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Saturday, August 8, 2020 | History

5 edition of 9th International Symposium on Advanced Packaging Materials found in the catalog.

9th International Symposium on Advanced Packaging Materials

processes, properties and interfaces : 2004 proceedings, March 24-26, 2004, Atlanta, GA, USA

by International Symposium on Advanced Packaging Materials (9th 2004 Atlanta, Ga.)

  • 211 Want to read
  • 27 Currently reading

Published by IEEE in Piscataway, N.J .
Written in English

    Subjects:
  • Electronic packaging -- Materials -- Congresses

  • Edition Notes

    Other titles2004 9th International Advanced Packaging Materials Symposium, Advanced Packaging Materials, rocesses, properties, interfaces, Processes, properties and interfaces
    Statementsponsors, IEEE Components, Packaging, and Manufacturing Technology (CPMT) Society, Packaging Research Center at Georgia Tech (GT-RRC) ; technical sponsor, Fraunhofer IZM, Germany ; general chair Petri Savolainen.
    GenreCongresses.
    ContributionsSavolainen, Petri., Components, Packaging & Manufacturing Technology Society., Georgia Institute of Technology. Packaging Research Center., Fraunhofer IZM.
    Classifications
    LC ClassificationsTK7870.15 .I586 2004
    The Physical Object
    Paginationvi, 281 p. :
    Number of Pages281
    ID Numbers
    Open LibraryOL3326657M
    ISBN 100780384369
    LC Control Number2004300557
    OCLC/WorldCa54952971

    The 14th International conference on materials chemistry (MC14) has been a key meeting in the materials calendar for two decades and is the flagship event for the RSC Materials Chemistry Division. The first meeting of this internationally renowned symposium was held in , and since then the meetings have been hosted by prominent institutions. The 9th IEEE International Symposium on Next-Generation Electronics (ISNE ) will be held at Changsha, China on July. 11th to 13th, Based on the successful experiences on past ISNEs, the ISNE will continuously provide a platform for experts, scholars and researchers from all over the world to convene and share novel ideas on next-generation electronics.

    International symposium and workshops. Advanced Packaging Materials: Processes, Properties and Interfaces, Recent Developments in Medical Biotechnology and Structure-Based Drug Designing, December 06 - 07, ; List of Best International Conferences: Industrial Pharmacy Conference April , Dubai, UAE.   Get this from a library! International Symposium on Advanced Packaging Materials: processes, properties and interfaces: proceedings: Chateau Elan, Braselton, Georgia, March , [C P Wong; International Microelectronics and Packaging Society.;].

    International Conference on Advanced Materials (ICAM ) 27–29 April , Irbid, Jordan. Volume VI International Scientific Practical Conference on Innovative Technologies and Economics in Engineering 21–23 May , Yurga, Russia. Volume 9th International Conference on Compressors and their Systems 7–9 September , London. DOI: /TEPM Corpus ID: Void Formation Study of Flip Chip in Package Using No-Flow Underfill @article{LeeVoidFS, title={Void Formation Study of Flip Chip in Package Using No-Flow Underfill}, author={S. Lee and M. Yim and R. N. Master and C. P. Wong and D. Baldwin}, journal={IEEE Transactions on Electronics Packaging Manufacturing}, year={}, volume={


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[Petri Savolainen; Components, Packaging & Manufacturing Technology Society. Advanced Packaging Materials--processes, properties and interfaces,proceedings, 9th International Symposium on.

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